Different melt pump adjustments, screw geometries, and screw speeds were tested and their effect on processing characteristics and material reinforcement was investigated. (C) 2009 Wiley Periodicals, Inc. J learn more Appl Polym Sci 113: 1422-1428, 2009″
“Dielectric and optical properties of (ZrO(2))(x)(SiO(2))(1-x) dielectric thin films, grown on Si(100) by the atomic layer deposition method, were studied by means of reflection electron energy loss spectroscopy (REELS). The quantitative analysis of REELS spectra was carried out by using the quantitative analysis
of electron energy loss spectra-epsilon(k,omega)-REELS software to determine the dielectric function and optical properties by using an analysis of experimental REELS cross sections from the simulated energy loss function (ELF). For ZrO(2), the ELF shows peaks in the vicinity Selleckchem BMS-777607 of 10, 15, 21, 27, 35, 42, and 57 eV. For SiO(2), a broad peak at 23 eV with a very weak shoulder at 15 eV and a shoulder at 34 eV were observed, while for Zr silicates (x=0.75 and 0.5), the peak position is similar to that of ZrO(2). For Zr silicates with high SiO(2)
concentration (x=0.25), the peak positions are similar to that of SiO(2), but the peak at 42 eV, which is due to excitation of Zr N(2,3) shell electrons, still exist. This indicates that the dielectric and optical properties of ZrO(2) thin films are dominating the dielectric and optical properties of Zr silicates even for high SiO(2) concentrations. In addition, the inelastic mean free path (IMFP) was also calculated from the theoretical inelastic cross section. The IMFP of Zr silicates increases with increasing Zr composition in Zr silicates, and they
also increase with increasing primary energy. The method of determining the dielectric and optical properties and IMFP from the ELF turns out to be a convenient tool for ultrathin high-k materials. (C) 2009 American Institute of Physics. [doi: 10.1063/1.3246612]“
“A novel fluorinated biphenyl-type epoxy resin (FBE) was synthesized by epoxidation of a fluorinated biphenyl-type phenolic resin, which was prepared by the condensation of 3-trifluoromethylphenol and 4,4′-bismethoxymethylbiphenyl catalyzed in the presence of strong Lewis acid. Resin blends click here mixed by FBE with phenolic resin as curing agent showed low melt viscosity (1.3-2.5 Pa s) at 120-122 degrees C. Experimental results indicated that the cured fluorinated epoxy resins possess good thermal stability with 50% weight loss under 409-415 degrees C, high glass-transition temperature of 139-151 degrees C (determined by dynamic mechanical analysis), and outstanding mechanical properties with flexural strength of 117-121 MPa as well as tensile strength of 71-72 MPa. The thermally cured fluorinated biphenyl-type epoxy resin also showed good electrical insulation properties with volume resistivity of 0.5-0.